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TDK-FA

TDF-FA_AFM

AFM

  • Gold to gold Flip Chip Ultrasonic Bonding Process
  • The highest mounthing accuracy
  • Lowest floor space required in the industry (1.1 m2)

Catalogue: (PDF)

Machine Running: (Video)

 
 

TDK FOUP Load Port TAS300 Type-E3

TDK FOUP Load Port TAS300 Type-E3

Features

  • Complies with SEMI Standard.
    E15.1,E47,E62,E63,E64.
  • Port door has excellent durability for repetitive operations.
  • No need to adjust Loadport for each FOUP Vendor.
  • Available option--Wafer Mapping Unit.