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TDK Flip Chip mounting & Dispenser
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AFM-15 Ultrasonic Gold-To-Gold Interconnect Process |
| Features |
The TDK AFM-15 Flip Chip Ultrasonic Gold-to-Gold Interconnect (GGI) Bonder provides a low temperature, precision, high reliability, die attach process.
The flip chip GGI die attach process provides up to a 70% form factor size reduction and superior electrical high frequency performance compared to other methods |
VIDEO
Machine RUNning
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MDM-2
Multi-dispenser |
| Features
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1. High-precision
coating by newly-developed image processore
2. Fine dispensing control by newly-developed
processor
3. The new best space saving i n the
industry. |
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